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本帖最后由 SanDisk 于 2011-8-12 11:58 编辑
【招聘】SanDisk晟碟半导体2012校园招聘给力启动！！
公司介绍
SanDisk 公司是全球最大的闪速数据存储卡产品供应商。公司由非易失性存储技术领域的国际权威Harari Eli博士在1988年创立。1995年11月，SanDisk成为了一家公开上市的公司，其纳斯达克股票代码为SNDK。2010年，SanDisk公司收入达到48亿美元。2011年SanDisk已成功跻身美国财富500强。公司总部设在美国加州硅谷，目前在全球范围内拥有超过3600名雇员。
SanDisk是闪存卡生产和销售领域的领导者，拥有全球大约三分之一的市场份额。是唯一一家有权制造和销售所有主要闪存卡格式的公司，包括Compact Flash®（CF）、SD、mini SD、Smart Media、Multi Media Card（MMC）、Memory Stick PRO和其它Memory Stick 产品，以及SD-Picture Card和USB闪存驱动盘。SanDisk在闪存领域不断推陈出新，从2004年至今，先后推出Cruzer Titanium —全球最坚固的 USB 闪存盘及全球速度最快、性能最高的闪存卡 SanDisk Extreme III、内置 USB 连接功能的两用 SD 存储卡以及 Micro-SD — 世界上最小的存储卡等。
公司将为员工提供优厚的薪酬待遇、快节奏的工作环境和广阔的发展空间。在 SanDisk，我们相信企业社会责任（CSR）是企业整体成功的一个重要因素。这意味着采用道德层面及可持续的商业实践来指导我们的经商之道，同时重点关注相关利益人和环境利益。
随着SanDisk在中国业务的迅速发展，研发团队规模不断的扩大。我公司计划面向2012年应届研究生和博士生招募研发职位若干。欢迎理工科背景相关专业的应届生报名申请。
申请方式：将个人中英文简历发送至邮箱：staffing_NCG@sandisk.com，请在邮件主题中注明应聘岗位和信息来源.
邮件主题格式：Job Title_Name_Univerisity_Major_Graduation Year_info source； Eg：Packaging Develop Engineer_San Zhang_Tsinghua University_Mechanical Engineering_2012_College BBS 。
公司地址：上海市闵行区江川东路388号
公司网址：http://www.sandisk.com/
http://www.cn.sandisk.com/
SanDisk 2012 NCG Hiring Job Description
Job Title 1: Packaging Develop Engineer
Department: Package Engineering R&D
Hiring requirement:
-- Master degree or Ph.D degree in Mechanical/ Information & Communication/ Automation/ Material Science, etc.
-- Good knowledge on Packaging engineering and popularly Science.
-- Good knowledge on computer, windows, office; Understand database is better.
-- Ability to achieve results in a fast moving, dynamic environment.
-- Good team work, willing to learn, logical thinking,
-- Excellent English communication (written and verbal) and interpersonal skills.
Job Responsibility:
-- Develops new package requirements and maintains quality of existing packages for all product groups.
-- Defines package requirements for product groups and customer requirements.
-- Develops new package and process qualification programs.
-- Using appropriate tools performs integrity analysis of packages. Performs package characterizations including cost effectiveness studies.
-- Acts as a liaison with vendors.
-- Maintains product quality while developing and introducing package cost reduction programs. Coordinates the introduction of new package processes into production.
-- Prepares and/or updates specifications for piece parts of integrated circuits or semiconductor assemblies.
Job Title 2: Characterization Test Engineer
Department: Characterization Test Engineering
Hiring Requirement:
-- Require a BSEE degree or plus with some experience at IC test & IC application.
-- Require familiarity with common lab equipment such as digital scope, logic analyzer.
-- Require good written and verbal English.
-- Require good communication skills with other groups.
Job Responsibility:
-- To do the NAND memory test characterization, using ATE tester.
-- Assist on low yield analysis on issues related with Circuit design.
-- Support System Engineering with failures Analysis.
-- Prepare the characterization report.
-- Perform AC/DC and logic/datasheet characterization across process, operating voltage and temperature.
Job Title 3: Product Engineer
Department: Memory Product Engineering
Hiring Requirement:
-- Require Master degree in Electronics Engineering
-- Good team work, willing to learn, logical thinking
-- Excellent English communication (written and verbal) and interpersonal skills
Job Responsibility:
-- In this position, the individual will be responsible for NAND Product Engineer and Package Qual/Rel tests setup/FA/Action Plan.
-- The individual will also be responsible for Product Evaluation DOE for Rel/DPPM improvement and D/S and KGD Sort Yield improvement.
-- The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment.
-- Self-motivated and self-directed, however, must have demonstrated ability to work well with people.
-- A proven desire to work as a team member, both on the same team and outside of the team.
-- Ability to troubleshoot and analyze complex problems.
-- Ability to multi-task and meet deadlines.
-- Excellent communication (written and verbal) and interpersonal skills.
Job Title 4: Test Development Engineer
Department: PETE CardTest/Adv Dev
Hiring Requirement:
-- This position requires a BS/MS degree in Computer Science/Electrical Engineering or equivalent and Strong C/C++ programming skills.
-- The individual should have experience with hardware debugging tools such as multimeters and logical analyzers.
-- The ideal individual must have proven ability to achieve results in a fast moving, dynamic environment.
-- The individual must be self-motivated and self directed, however, must have also demonstrated ability to work well with people and have a proven desire to work as a team member, both on the same team and outside of the team.
-- In addition, the individual must have the abilities to work effectively cross-functionally, coordinate priorities and initiatives, troubleshoot and analyze complex problems, and to manage multiple projects simultaneously while meeting deadlines.
-- Excellent English communication (written and verbal) and interpersonal skills are required.
Job Responsibility:
-- In this position, the individual will be responsible for writing test program code for a variety of SanDisk Flash Card product types from design documents, systems manuals, and input from other System Design and Firmware Departments.
-- Production Test Program coding will heavily involve C++ for embedded processor test systems. The individual will debug test programs using tester system tools and bench equipment such as oscilloscopes, meters, and logic analyzers.
-- The individual will be responsible for full automated test cell with tester and device handler, developing characterization and evaluation programs for new products, and supporting failure analysis on test systems.
If you are interested in this position, please send your CVs (both in Chinese & English) to:" staffing_NCG@sandisk.com" with your email subject as " Job Title_Name_Univerisity_Major_Graduation Year_info source ", Eg: " Packaging Develop Engineer_San Zhang_Tsinghua University_Mechanical Engineering_2012_College BBS ".
如想您想进一步了解SanDisk晟碟或此次的NCG项目，请直接回帖询问或站内投条，我们会第一时间给予答复。\(^o^)/~
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发表于 2011-8-12 11:54:54