Intel招聘实习生（4 positions）

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Intel招聘实习生（4 positions）

HW Verification test analysis

Location: Shanghai  

Contact: frank.wei@intel.com

Graduate students major in electronic engineering or equivalent. Additional qualifications include:

- Expected to work at least 4 working days every week and last at least 6 months;

- A team player with good oral and written communication skills, and the ability to work in cross-functional team;

- Hard working, carefulness, patience, and disciplined;

- Have basic knowledge of PC architecture. Understand electrical characters of PC components and basics of SI testing;

- Experience in EXCEL VBA;

- Experience in using oscilloscope;

- Experience in PCB design is a preferred advantage.


In this position, you will be assisting hardware verification engineers in verifying HW design of global 1st class Intel server motherboards. You will execute HW tests like server stress test, functional tests and SI measurements. You will independently organize and analysis test data, design data mining solution by Microsoft Excel to improve test efficiency.


Embedded Software Intern
Location： Shanghai.
Contact：harris.zeng@intel.com

In this position, you will be joining a Technical Marketing team in Intelligent Systems Group, as an Embedded Software Intern and working under the supervision of the Software Platform Application Engineers (PAE). You will be responsible for supporting Intel Communication platforms setup in Intel lab (and in customers), develop and run specific test scenarios to prove Intel IA’s (Intel Architecture) capability in multiple Telecom/Datacom segments. You’ll also work together with PAEs participate in customer support activities by helping customers debugging software issues and doing performance benchmarking and optimizations. In this position, you’ll have the opportunity to study the leading-edge processor and software technologies, as well as to increase your understanding of Telecom/Datacom systems, protocols, applications, and enhance your hands-on capability of IA platform, software tools, test equipments, etc.


Qualifications

You must possess a Master Degree in Computer Engineering, Telecom Engineering, Computer Science or equivalent. Additional qualifications include:

- Experiences in developing Linux* or Windows* based application

- Familiarity with Networking and Communication protocols, i.e. TCP/IP

- Familiarity with scripting languages and/or C/C++ languages

- Knowledge of software development and test processes

- Familiarity with embedded software design, development, optimization and validation

- Excellent communication and interpersonal skills

- Flexible and eager to learn; work well with team members

- Proficiency in written and spoken English


Packaging Engineer Intern

Contact:  Jimmy (Gensheng.dai@intel.com)

Work location: Shanghai

Job Description

1.     Assist package engineer on package design (Carton Boxes and EPE materials  [纸箱和EPE材料]) .

2.     Assist package engineer on package material qualification (Carton Boxes and EPE materials[纸箱和EPE材料]) .

3.     Organize and track the package information and maintain the database for EPSD systems package

4.     Assist Regulatory engineer and system engineers on  maintain database and perform system  testing.

Requirements

1.     Prefer the candidate is working on Bachelor or Master Degree on Packaging related field (包材相关专业) or mechanical engineering, about 1 year away from graduation.

2.     Detail Orientated, good communication skills.

3.     English fluent.

4.     Prefer to familiar with Pro E and Auto CAD

5.     Able to work at least 3 a week, at least 4 hours each time  If able to work longer: 5 days a week, it will be great. (Need to work more than 20 hours a week.)


Build/Automation Intern

Location：Shanghai

Contact: Zhuxin.yang@intel.com

Description

Responsibility:

In this position, You will be joining Intel Media team in PRC. You will be responsible for working as a build and automation engineer. Responsibilities include but are not limited to:

- Develop build scripts and maintain the build system

- Maintain build infrastructure (SVN, Wiki, etc)

- Explore build and test automation methods


Qualitification:

Candidates should be pursuing 2013/2014 master degree in CS or EE. Additional qualifications include:

- Familiar with Linux environment

- Knowledge of SCM tools (Subversion, etc)

- Knowledge/Experience of Shell and Python script programming

- Good communication skills in both English and Mandarin

- Able to work at least 4 days a week