Intel实习2G/Audio Firmware Intern

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Job Title:2G/Audio Firmware Intern
Location: Xian
Contact:Irene.i.liew@intel.com

Responsibilities:
The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms.  PEG strives to lead the industry moving forward through product innovation and world class engineering.
•        Maintaining existing projects with support by experienced engineers.
•        Job assignments are usually for the summer or for short periods during breaks from school.

Qualifications:
•        GSM or related wireless communication background
•        DSP programing experience, C language, I2S, Slimbus, RTOS, Firmware debugging skills
•        Fluent spoken and written English.
•        Graduate, major in communication, EE or Computer science.

Please state the ‘Job title’ when you apply to Irene.i.liew@intel.com
Thank you.