【英特尔上海实习】Packaging Engineering Intern

Dons

Job Title: 【英特尔上海实习】Packaging Engineering Intern
Location: Shanghai

Contact: saw.yen.yew@intel.com

Job Description:

You must possess at least a Bachelor or Master degree in packaging engineering or mechanical engineering, or equivalent.
The candidate will join CPLG, Global Logistics Operations GLO in Transport Media & material Engineering TMME, responsibilities & duties includes:
- Assist packaging engineer in packaging development, including the creation of packaging designs, prototype development, and performance testing. As well as troubleshoot new and existing packaging problems involving designs, materials and processes.
- Analyze engineering drawings and specifications of product to determine physical characteristics of item, special handling, environmental and safety requirements, and types of materials required for packaging.
- He/she will also possess excellent English/Chinese written and Chinese verbal communication skills.
- Candidate must commit to at least 6 months internship for 3 days per week.

Please subject your email as ‘【Intel】Packaging Engineering Intern_Shanghai_XX days per week_XX months’ when applying to saw.yen.yew@intel.com