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英特尔实习生【Intel】JR0024577 Electronic Package Engineering Graduate Student Intern

Location: Shanghai
Position opened: 1
Term: 1 year preferred
Working time: 4-5 days/week, full time is preferred
Contact: si.yeu.lai@intel.com


Job Description
The Non-Volatile Memory group in Intel Shanghai is looking for a salaried intern to support packaging technology development and path finding (research) projects that will involve material selection, evaluating assembly material/process impact on product electrical/thermal/mechanical performance, and assembly materials-level failure analysis work (cross-section analysis, optical microscopy, x-ray). This position will also include the coordination of DOE (design of experiment) build and data analysis. This will involve working with assembly subcons, planning, and electrical test groups. Through careful material selection, define DOE, coordinating assembly build, and failure analysis, candidate should be able to identify the optimized material/process for a specific product, find the root cause for failures, and provide regular updates and summarize findings in a report. Additional project responsibilities will be added once project begins.

Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.

Minimum Qualifications:
The candidate must be pursuing a Master or Ph.D. degree in Materials Science, Metallurgical Engineering, Chemical Engineering, Mechanical Engineering or related field.
The candidate must have the unrestricted right to work in Shanghai without requiring sponsorship.  

Preferred Qualifications:
3+ months of experience in electronic materials processing.
3+ months of experience in IC fabrication process.
3+ months of experience in electronic packaging materials and/or assembly process.
3+ months of experience in fast paced environment.

Please subject your email as ‘JR0024577 Electronic Package Engineering Graduate Student Internship_Shanghai_XX days_per week_XX months’ when applying to si.yeu.lai@intel.com