我们是西部数据的Mechanical Thermal Design and Solution MTDS团队,正在招聘一位Structural Simulation实习生。该职位将与芯片封装研发部门紧密合作,对闪存芯片封装进行结构仿真,并给出相应的设计方案。
工作地点在紫竹园江川东路388号。
有兴趣的同学可以联系和投递简历至 Tim.Huang@wdc.com
更多信息咨询可以添加vx: addole
期待您的参与!
Responsibilities:
Support mechanical simulation for electronic package design and development, such like warpage, stress analysis.
Conduct material properties characterization for mechanical simulation ,such like DMA, TMA, 3 points bending, tensile test, ect.
Co-work in simulation secondary development based on ANSYS workbench
Requirements:
Current student, pursuing a Master or Ph.D. degree in Mechanical Engineering, Material Engineering, or related
Proficient in CAE tools, such as ANSYS and ABAQUS
Familiar with mechanical behavior of materials including metals, polymers and composites
Experience with Java, Python or Fortran programming preferred
At least work 3 days a week |