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Job Title: DSP/Firmware Audio Engineer
Department: Cellular Engineering
Location: Shanghai/Nanjing
Job Description:
-We are looking for a Senior DSP/Firmware Engineer with solid background in audio processing to join our system design team for wireless communication system, include 2G/3G/4G
-Help customer do audio design related to the implementation with acoustic components and hardware circuit
-Cooperate with customer to definite and develop audio DSP block
-Instruct customer to implement audio tuning
-Support customer to analyze and solve audio related problems
Qualification:
-B.Sc. in Signal & information Processing Engineering, Electronic Engineering, Telecommunication Engineering or other relevant major
-At least 3 years of relevant working experience with emphasis on audio DSP tuning, hardware circuit design
-Familiar with mobile phone test Standard
-Familiar with acoustic design of audio components
-Familiar with architecture application of one audio DSP processor
-Have the basic knowledge of signal process algorithm, such as echo cancellation and so on
-Knowledge and experience on the communication physical layer are preferred
-Good communication skills in spoken and written English
-Good at collaboration and team work
If you are interested in any one of the four positions, please send your resume to the following email address: jiangrr@marvell.com
Subject of your email should be: School_Name_Applied position_Information source
Eg.SJTU_Zhang Peng _Data Analyst_BBS
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