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IC Backend Design Engineer Intern
Location: Shanghai
Responsibilities:
- Work with the global design team to do complex SOC physical implementation for deep submicro design.
- Participates in chip level and block level backend design for complex SOC designs.
- Responsible for RTL to GDS flow including CPF definition, logic/physical synthesis, die size estimation, floor-planning, power planning, CTS, place and route, STA, signal integrity, timing closure, formal verification, DFM, DRC/LVS etc.
Requirements:
- University degree in microelectronics engineering or equivalent, master degree or above is preferred;
- Relevant Experience in floor-planning, power planning, place and route, STA, IR drop and signal integrity, DRC/LVS;
- Good understanding on soc backend flow and process, special for partition flow;
- Good communication skills is must, English language proficiency.
请将简历直接发至juno.tang@nxp.com |
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